thermoformed cup

AMI Thin Wall Packaging Asia 2017

CMT Materials will be presenting new data on managing wall thickness variation in thermoformed parts at the 2nd annual AMI Thin Wall Packaging Conference Asia (September 18-19). Located in the heart of the dynamic ASEAN region, attendees will participate in this second-to-none networking and experience a compelling conference program.

Thin Wall Packaging 2017 will offer a unique networking opportunity for leading food companies, retailers, packaging manufacturers, researchers, and suppliers of the industry to debate the latest developments and market trends in light weight plastics packaging.