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AMI Thin Wall Packaging North America 2017

AMI Thin Wall Packaging North America Conference
May 23-24, 2017
Westin Chicago North Shore
Chicago, IL

CMT Materials will be presenting new data on managing wall thickness variation in thermoformed parts at the 6th annual AMI North American Thin Wall Packaging Conference. Located in the heart of the packaging industry, attendees will participate in this second-to-none networking and experience a compelling conference program.

Thin Wall Packaging 2017 will offer a unique networking opportunity for leading food companies, retailers, packaging manufacturers, researchers, and suppliers of the industry to debate the latest developments and market trends in light weight plastics packaging.