2015 SPE Thermoforming Conference Preview

The annual SPE Thermoforming Conference starts early this year – August 31 in Atlanta, GA. CMT will be there in booth 325-327 with our full spectrum of tooling materials: HYTAC syntactic foam for plug assists; Metapor porous aluminum; RenShape tooling and modeling board; cutting tools and machining guides.

This year we will also be exhibiting our newest material – HYVAC LCM. LCM (lightweight composite material) is a 2-part syntactic kit designed for cut-sheet thermoformers (see earlier blog post on trials at Penn College). Our GM, Terry Woldorf, will be presenting the features and benefits of the material in one of the Innovation Brief segments at 2:30pm on Tuesday, September 1. Here is our abstract:

As a result of more stringent quality requirements in the cut sheet segment, CMT Materials, Inc. engineers have developed a new materials and process that offers dramatic savings in mold making  and provides results on par or better than aluminum for low-to-medium run projects. 

The new syntactic foam material, released as HYVAC-LCM, utilizes a porous core covered by a layer of syntactic foam.  Due to its low thermal conductivity, syntactic foam does not impart stress to the plastic as occurs with aluminum molds.  No temperature control is required for the mold.  When forming a part, the approach offers improved materials distribution in the same cycle time, while  offering much longer tool life than wood, MDF or other toolboard materials.

We look forward to seeing many of our customers and partners at the show. In the meantime, enjoy your summer holidays!