CMT Field Notes: 2015 European Thin Wall Packaging Conference
This year marked the 10th anniversary of AMI’s Thin Wall Packaging Conference in Europe. What started as a small gathering with only 48 people in 2005 is now an important industry event that consistently draws over 200 delegates. Brand owners, resin suppliers, converters and OEMs from both sides of the Atlantic are drawn to the city of Cologne to hear the latest developments in materials and processes for thermoformed and injection molded thin wall packaging. With conferences already established in Europe and North America, AMI is expanding to Southeast Asia next year with a new event in Singapore (September 20-21).
