It’s been quiet on the blog front for a few weeks now, but that doesn’t mean we’ve been sitting around at the beach all summer. Industry reports continue to show plastic packaging is on the rise, with thermoformed parts contributing to overall growth. As we pointed out in previous blogs and articles, megatrends such as sustainability and middle-class growth in Asia, in particular, are opening up new opportunities for innovative package designs that marry convenience and functionality. Of course, those packages are only optimized through the correct use of HYTAC plug assists!
The thermoforming world will have an opportunity to discuss these and other trends in sunny Orlando next month. The SPE Thermoforming Division has created a new and exciting format for 2017 with panel discussions, roundtables, a “War Room” and an RC Car Race. Evening events include a “Casino Night” to raise funds for scholarships.
Also in September, we are heading back to Singapore to present a paper at the AMI Thin Wall Packaging Conference Asia. The event returns to the dynamic region of South East Asia for the second year and the organizers are anticipating over 100 delegates. Later this year in October, CMT will be participating in the International Plastic Fair in Tokyo, Japan with our distribution partners. With additional events in Mexico (Plastimagen 2017) and Germany (AMI Thin Wall Europe), the calendar is fully booked for the rest of the year.
Are you planning to attend some or all of these events? Let us know so we can schedule a meeting to discuss your latest thermoforming project.