2019 SPE Thermoforming Division Conference – Milwaukee

CMT was delighted to participate in another great SPE Thermoforming conference, held this year in Milwaukee, Wisconsin. Individual seminars were informative and well attended. With the unfortunate absence of Mark Strachan, we applaud the last-minute presenters that had the unenviable task of filling Mark’s shoes. Although Mark was deeply missed, the conference and adjunct presenters were spectacular in providing good information, making for productive seminars for all those in attendance.

CMT would like to recognize Ian Munnoch of MSA Components for the honor bestowed upon him as the 2019 SPE Outstanding Board Member of the Year. Ian was also one of the SPE members that gave a last-minute presentation on the science behind plug assist material and geometry.

Number 1 on the hot topic of conversation list at the CMT booth was HYTAC®-C1R copolymer plug assist material.  This very durable, high friction product provides excellent results for deep draw products and challenging part geometries. C1R’s great optical results with clear Polypropylene was also recognized in multiple discussions.

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CMT Commentary on SPE Thermoforming Conference 2017

Like many colleagues in the thermoforming industry, our thoughts are primarily with those affected by Hurricane Irma. The decision taken by the Board of Directors of the SPE Thermoforming Division was not an easy one, but it was the right one. Conferences can be rescheduled; hurricanes cannot.

CMT is a long-standing exhibitor at the Thermoforming Conference and a strong supporter of The Society of Plastics Engineers. We will be ready to participate again as soon as new information is available.

For the remainder of 2017, we are going to wrap up our world tour with talks at AMI Thin Wall Packaging Asia (Sept 18-19), exhibits at IPF Japan (Oct 24-28), and a tabletop position at AMI Thin Wall Packaging Europe (Dec 6-8). If you are attending any of these events, be sure to visit us. Alternatively, get in touch directly to discuss any new applications.