CMT Materials Gears Up for K 2013

In just two weeks, the tri-annual K Fair will kick off in Dusseldorf. The venerable global plastics trade show is now its 60th year and we’re sure that the halls of the massive Messe will be crammed full of international visitors. Beyond business meetings in the multi-level booths from polymer giants and plastics multinationals, attendees will be treating themselves to the hearty German fare being served up. Schweinhaxen, anyone?

Given the correspondence in recent weeks, it’s clear that tool designers, processors and machinists from all over the world will be congregating at our booth in Hall 3, Stand B52. We’re planning on serving up plenty of information, tips and guidelines on HYTAC® syntactic foam with an emphasis on new XTL thermoplastic syntactic. We’ll be there with our distribution partners from Europe and Asia to display cutting tools and share best practices from around the world. Here’s a short version of our dance card:

HYTAC® XTL: The Next Generation Thermoplastic Syntactic.  This mauve colored material was developed to improve our popular HYTAC®-B1X line by creating a thermoplastic that was both easy to machine and polish.  HYTAC®-XTL also surpasses B1X in toughness while offering the lowest thermal conductivity and lowest thermal expansion of any thermoplastic syntactic foam.  Developed in 2012 and commercialized in 2013, it is quickly growing in popularity as the “do-it-all” syntactic plug material.  The easily polished surface is ideal for use with transparent plastics and easy sheet release while surviving the most demanding applications.

HYTAC® plug material is being used in multiple show tools for all the major OEMs including IlligKiefelGablerOMGGNWM and it will also be on display for several key thermoform tooling companies including BoschSprangMarbachTermostampiMould & Matic and Techno Tool A/S

So if you’re going to Dusseldorf, be sure to visit us in Hall 3, Stand B52. And if you can’t make it, be sure to check back with us to read our report of the show.